TSTCB/EC 전자 콘솔 ("TXC/...B" 유형 모듈에 공통)

The Heat Transfer Series, "TSTCB," has been designed by EDIBON to study and compare different types of heat transfer on a small scale. It allows a wide range of heat transfer demonstrations and study the factors affecting and problems associated with different types of heat transfer.

The minimum supply consists of two main elements: Electronic Console for TSTCB (Common for all "TXC/..B" type modules), "TSTCB/EC", and at least one of the required elements described below.

Each heat transfer module can be individually connected to the Electronic Console for TSTCB (Common for all "TXC/..B" type modules) "TSTCB/EC", which provides the necessary electrical supply and instrumentation connections for the study of the different types of heat transfer.

Elements required (at least one) (Not included):

• TXC/CLB. Linear Heat Conduction Module for TSTCB.
• TXC/CRB. Radial Heat Conduction Module for TSTCB.
• TXC/RCB. Radiation Heat Transfer Module for TSTCB.
• TXC/CCB. Combined Free and Forced Convection and Radiation Module for TSTCB.
• TXC/SEB. Extended Surface Heat Transfer Module for TSTCB.
• TXC/ERB. Radiation Errors in Temperature Measurement Module for TSTCB.
• TXC/EIB. Unsteady State Heat Transfer Module for TSTCB.
• TXC/LGB. Thermal Conductivity of Liquids and Gases Module for TSTCB.
• TXC/FFB. Free and Forced Convection Heat Transfer Module for TSTCB.
• TXC/TEB. Three Axes Heat Transfer Module for TSTCB.
• TXC/MMB. Metal to Metal Heat Transfer Module for TSTCB.
• TXC/TCB. Ceramic Heat Transfer Module for TSTCB.
• TXC/TIB. Insulating Material Heat Transfer Module for TSTCB.