TSTCB/EC 电子控制台(适用于所有 "TXC/...B" 类型的模块)

ELECTRONIC CONSOLE (COMMON FOR AVAILABLE MODULES TYPE "TXC/...B") - TSTCB/EC

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The Heat Transfer Series, "TSTCB," has been designed by EDIBON to study and compare different types of heat transfer on a small scale. It allows a wide range of heat transfer demonstrations and study the factors affecting and problems associated with different types of heat transfer.

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一般說明

The Heat Transfer Series, "TSTCB," has been designed by EDIBON to study and compare different types of heat transfer on a small scale. It allows a wide range of heat transfer demonstrations and study the factors affecting and problems associated with different types of heat transfer.

The minimum supply consists of two main elements: Electronic Console for TSTCB (Common for all "TXC/..B" type modules), "TSTCB/EC", and at least one of the required elements described below.

Each heat transfer module can be individually connected to the Electronic Console for TSTCB (Common for all "TXC/..B" type modules) "TSTCB/EC", which provides the necessary electrical supply and instrumentation connections for the study of the different types of heat transfer.

Elements required (at least one) (Not included):

  • TXC/CLB. Linear Heat Conduction Module for TSTCB.
  • TXC/CRB. Radial Heat Conduction Module for TSTCB.
  • TXC/RCB. Radiation Heat Transfer Module for TSTCB.
  • TXC/CCB. Combined Free and Forced Convection and Radiation Module for TSTCB.
  • TXC/SEB. Extended Surface Heat Transfer Module for TSTCB.
  • TXC/ERB. Radiation Errors in Temperature Measurement Module for TSTCB.
  • TXC/EIB. Unsteady State Heat Transfer Module for TSTCB.
  • TXC/LGB. Thermal Conductivity of Liquids and Gases Module for TSTCB.
  • TXC/FFB. Free and Forced Convection Heat Transfer Module for TSTCB.
  • TXC/TEB. Three Axes Heat Transfer Module for TSTCB.
  • TXC/MMB. Metal to Metal Heat Transfer Module for TSTCB.
  • TXC/TCB. Ceramic Heat Transfer Module for TSTCB.
  • TXC/TIB. Insulating Material Heat Transfer Module for TSTCB.

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